Thermal conductivity and interfacial thermal conductance play crucial roles in the design of engineering systems where temperature and thermal stress are of concerns. To date, a variety of measurement techniques are available for both bulk and thin film solid-state materials with a broad temperature range. For thermal characterization of bulk material, we use Comparative cut bar technique. A standard material with known thermal conductivity is mounted in series with the test sample. It is measured in W/m·K Thermal conductivity test system is designed and developed by our company and has recognition in INDIA. The new system is digital and has PC USB interface. Total operations are performed by highly advanced Thermal conductivity system test software.